Will “Semiconductor Wafers Marker” be Replaced By Robots? 🤔

88% Chance of Automation

“Semiconductor Wafers Marker” will probably be replaced by robots.

This job is ranked #514 out of #702. A higher ranking (i.e., a lower number) means the job is less likely to be replaced.

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Job Description

Perform any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; and clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.

Job Details

The SOC (Standard Occupational Classification) code is 51-9141.00
The Mean Annual Wage in the U.S. is $ 37,890.00
The Mean Hourly Wage is $ 18.00
Currently, there are 24,430 people on this job

☝️ Information based on the reference occupation “Semiconductor Processors”.

Also Known As…

Tasks for “Semiconductor Wafers Marker”

Load semiconductor material into furnace.
Scribe or separate wafers into dice.
Measure and weigh amounts of crystal growing materials, mix and grind materials, load materials into container, and monitor processing procedures to help identify crystal growing problems.
Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment.
Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.
Operate saw to cut remelt into sections of specified size or to cut ingots into wafers.
Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.
Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.
Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.
Load and unload equipment chambers and transport finished product to storage or to area for further processing.
Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.
Attach ampoule to diffusion pump to remove air from ampoule, and seal ampoule, using blowtorch.
Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.
Calculate etching time based on thickness of material to be removed from wafers or crystals.
Maintain processing, production, and inspection information and reports.
Count, sort, and weigh processed items.
Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.
Connect reactor to computer, using hand tools and power tools.
Inspect equipment for leaks, diagnose malfunctions, and request repairs.
Stamp, etch, or scribe identifying information on finished component according to specifications.
Locate crystal axis of ingot, and draw orientation lines on ingot, using x-ray equipment, drill, and sanding machine.
Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.
Mount crystal ingots or wafers on blocks or plastic laminate, using special mounting devices, to facilitate their positioning in the holding fixtures of sawing, drilling, grinding or sanding equipment.
Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.

Related Technology & Tools

Wafer mappers
X-ray inspection equipment
Soldering guns
Low pressure chemical vapor deposition LPCVD machines
Laser wafer markers
Wafer scanners
Safety eyewear
Slurry filter cabinets
Clean room suits
Sanding machines
Epitaxial deposition equipment
Die bonders
Plasma ashers
Chemical vapor deposition CVD systems
Photoresist strippers
Oxidation systems
Clean-room air particle analyzers
Lithography exposure systems
Vacuum pumps
Clean room ovens
Load ports
Diffusion furnaces
Digital multimeters
Photostabilizers
Wafer sorters
Automatic wafer cleaners
Gas blow torches
Physical vapor deposition systems
Semiconductor polishers
Spin rinse dryers
Laboratory fume hoods
Vacuum wands
Digital hygrometers
Solder reflow ovens
Electron beam evaporators
Rapid thermal processors
Desktop computers
Spectrum analyzers
Atmospheric pressure chemical vapor deposition APCVD systems
Diffusion pumps
Scanning electron microscopes
Ion implanters
Water surface contamination analyzers
Solder-paste printers
Wafer probers
Semiconductor test probes
Surface profilers
Semiconductor etchers
Manual wet benches
Mask aligners
Semiconductor processing chillers
Sputterers
High precision tweezers
Plasma-enhanced chemical vapor deposition PECVD machines
Vacuum ovens
Antistatic wrist straps
Photolithography equipment
Micro diamond scribers
Wafer arbor presses
Automatic notched wafer aligners
Surface resistivity meters

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