Will “Semiconductor Technician” be Replaced By Robots? 🤔

88% Chance of Automation

“Semiconductor Technician” will probably be replaced by robots.

This job is ranked #514 out of #702. A higher ranking (i.e., a lower number) means the job is less likely to be replaced.

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Job Description

Perform any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; and clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.

Job Details

The SOC (Standard Occupational Classification) code is 51-9141.00
The Mean Annual Wage in the U.S. is $ 37,890.00
The Mean Hourly Wage is $ 18.00
Currently, there are 24,430 people on this job

☝️ Information based on the reference occupation “Semiconductor Processors”.

Also Known As…

Tasks for “Semiconductor Technician”

Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.
Stamp, etch, or scribe identifying information on finished component according to specifications.
Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.
Inspect equipment for leaks, diagnose malfunctions, and request repairs.
Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment.
Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.
Locate crystal axis of ingot, and draw orientation lines on ingot, using x-ray equipment, drill, and sanding machine.
Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.
Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.
Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.
Load semiconductor material into furnace.
Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.
Calculate etching time based on thickness of material to be removed from wafers or crystals.
Maintain processing, production, and inspection information and reports.
Operate saw to cut remelt into sections of specified size or to cut ingots into wafers.
Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.
Scribe or separate wafers into dice.
Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.
Count, sort, and weigh processed items.
Measure and weigh amounts of crystal growing materials, mix and grind materials, load materials into container, and monitor processing procedures to help identify crystal growing problems.
Connect reactor to computer, using hand tools and power tools.
Load and unload equipment chambers and transport finished product to storage or to area for further processing.
Attach ampoule to diffusion pump to remove air from ampoule, and seal ampoule, using blowtorch.
Mount crystal ingots or wafers on blocks or plastic laminate, using special mounting devices, to facilitate their positioning in the holding fixtures of sawing, drilling, grinding or sanding equipment.

Related Technology & Tools

Sputterers
Scanning electron microscopes
Solder reflow ovens
Oxidation systems
Semiconductor test probes
Mask aligners
Manual wet benches
Ion implanters
Clean room ovens
Laboratory fume hoods
Surface profilers
Safety eyewear
Chemical vapor deposition CVD systems
Clean room suits
Physical vapor deposition systems
Vacuum ovens
Wafer probers
Spin rinse dryers
Diffusion pumps
Plasma-enhanced chemical vapor deposition PECVD machines
Water surface contamination analyzers
Vacuum pumps
Gas blow torches
Semiconductor etchers
X-ray inspection equipment
Micro diamond scribers
Antistatic wrist straps
Wafer mappers
High precision tweezers
Solder-paste printers
Load ports
Photostabilizers
Soldering guns
Low pressure chemical vapor deposition LPCVD machines
Vacuum wands
Photolithography equipment
Die bonders
Wafer arbor presses
Wafer scanners
Plasma ashers
Digital hygrometers
Atmospheric pressure chemical vapor deposition APCVD systems
Lithography exposure systems
Clean-room air particle analyzers
Slurry filter cabinets
Desktop computers
Spectrum analyzers
Surface resistivity meters
Automatic notched wafer aligners
Digital multimeters
Automatic wafer cleaners
Rapid thermal processors
Photoresist strippers
Electron beam evaporators
Semiconductor polishers
Laser wafer markers
Diffusion furnaces
Sanding machines
Wafer sorters
Epitaxial deposition equipment
Semiconductor processing chillers

Database software
Microsoft Office
yieldWerx
Camstar Systems Camstar Semiconductor Suite
National Instruments TestStand
Microsoft Word
Microsoft Excel
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